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Known good die achieved through wafer level burn-in and test

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3 Author(s)
Ballouli, W. ; Motorola Semicond. Products Sector, Austin, TX, USA ; McKenzie, T. ; Alizy, N.

Motorola has developed and qualified a low-cost method to burn-in and test die at the wafer level rather than the historical die package level. This wafer level burn-in method utilizes a sacrificial metal circuit that is applied to the wafer at the post-fabrication process. The sacrificial metal circuit is designed so that each die is connected to adjacent dice to form die clusters. These clusters are electrically powered by a set signal, power, and ground circuitry. Sacrificial metal test pads allow contact to the cluster for burn-in and electrical testing. The test pads can be placed over active dice or around the wafer perimeter

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Electronics Manufacturing Technology Symposium, 2000. Twenty-Sixth IEEE/CPMT International

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