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We demonstrate the effect of sputter gas pressure and film thickness, d, on the coercivity of Co in Al/Co/Cu sputterdeposited on Si(001). Increased sputter gas pressure produces increased rms roughness and increased O content in our films. The deposited Co thickness at which the onset of ferromagnetism is first observed, dc, increases with sputter gas pressure. Above this thickness,d > dc, the coercivity increases with increasing Co thickness. For film thickness d ≫ dc, the coercivity is thickness independent. We show that coercivity is directly controllable at technologically relevant thicknesses by regulating sputter-deposition parameters.