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Vacuum packaging technology using localized aluminum/silicon-to-glass bonding

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5 Author(s)
Cheng, Y.T. ; Center for Wireless Integrated Microsyst., Michigan Univ., Ann Arbor, MI, USA ; Hsu, W.T. ; Lin, L. ; Nguyen, C.T.
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A vacuum package based on localized aluminum/silicon-to-glass bonding has been successfully demonstrated. With 3.4 watts heating power, /spl sim/0.2 MPa applied contact pressure, and 90 minutes wait time before bonding, vacuum encapsulation at 25 mtorr can be achieved. Folded-beam comb drive /spl mu/-resonators are encapsulated and used as pressure monitors. Long-term testing of un-annealed vacuum-packaged /spl mu/-resonators with a Q of 2500 has demonstrated stable operation after 20 weeks. A /spl mu/-resonator with Q of /spl sim/9600 has been vacuum encapsulated and shown to be stable after 7 weeks.

Published in:

Micro Electro Mechanical Systems, 2001. MEMS 2001. The 14th IEEE International Conference on

Date of Conference:

25-25 Jan. 2001

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