Close category search window
 

Acoustic and facial features for speaker recognition

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Roach, M.J. ; Dept. of Electr. & Electron. Eng., Univ. of Wales Swanea, UK ; Brand, J.D. ; Mason, J.S.D.

This paper gives an insight into biometrics used for speaker recognition. Three different biometrics are presented, based on: acoustic, geometric lip, and holistic facial features. Experiments are carried out using a corpus of the DAVID audio-visual database. Recognition accuracy is found to be similar in the 2 domains. The geometric visual feature is based on a method of signature coding of the contour of the lips and the holistic feature is based on a mean dynamic signature, a method of capturing the motions of the face during a spoken utterance. Physical biometrics (static measurements) demand only small model sizes, perhaps just a single template, and therefore require less training data. Conversely behavioral biometrics contain more variation and demand more training data

Published in:
Pattern Recognition, 2000. Proceedings. 15th International Conference on  (Volume:3 )

Date of Conference: 2000

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.