By Topic

The potential of diamond and SiC electronic devices for microwave and millimeter-wave power applications

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Trew, R.J. ; Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA ; Yan, J.-B. ; Mock, P.M.

The potential of SiC and diamond for producing microwave and millimeter-wave electronic devices is reviewed. It is shown that both of these materials possess characteristics that may permit RF electronic devices with performance similar to or greater than what is available from devices fabricated from the commonly used semiconductors, Si, GaAs, and InP. Theoretical calculations of the RF performance potential of several candidate high-frequency device structures are presented: the metal semiconductor field-effect transistor (MESFET), the impact avalanche transit-time (IMPATT) diode, and the bipolar junction transistor (BJT). Diamond MESFETs are capable of producing over 200 W of X-band power as compared to about 8 W for GaAs MESFETs. Devices fabricated from SiC should perform between these limits. Diamond and SiC IMPATT diodes also are capable of producing improved RF power compared to Si, GaAs, and InP devices at microwave frequencies. RF performance degrades with frequency and only marginal improvements are indicated at millimeter-wave frequencies. Bipolar transistors fabricated from wide bandgap material probably offer improved RF performance only at UHF and low microwave frequencies

Published in:

Proceedings of the IEEE  (Volume:79 ,  Issue: 5 )