Cart (Loading....) | Create Account
Close category search window

Scattering matrices representing the transformations between modal bases in rectangular waveguide

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Morini, A. ; Dipt. di Elettronica e Autom., Ancona Univ., Italy ; Rozzi, T. ; Zappelli, L.

The excitation of hybrid modes by discontinuities in rectangular waveguide can often be decomposed into separate LSE/LSM or TE/TM mechanisms, so that each component can be analyzed with the most suitable modal base. Correct interfacing, however, is required. We report the scattering matrices representing all the possible transformations of modal bases in rectangular waveguide. Such matrices provide an useful tool to simulate complex circuits made up of components strongly interacting, without requiring the use of a common modal base for the characterization of each element. Since the transformation matrices can easily include pieces of transmission lines, their use does not require any additional computation effort

Published in:

Microwave Theory and Techniques, IEEE Transactions on  (Volume:49 ,  Issue: 1 )

Date of Publication:

Jan 2001

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.