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Thermal coupling in integrated circuits: application to thermal testing

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5 Author(s)
J. Altet ; Dept. of Electron. Eng., Polytech. Univ. of Catalonia, Barcelona, Spain ; A. Rubio ; E. Schaub ; S. Dilhaire
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The power dissipated by the devices of a circuit can be construed as a signature of the circuit's performance and state. Without disturbing the circuit operation, this power consumption can be monitored by temperature measurements of the silicon die surface via built-in differential temperature sensors. In this paper, dynamic and spatial thermal behavioral characterization of VLSI MOS devices is presented using laser thermoreflectance measurements and on-chip differential temperature sensing circuits. A discussion of the application of built-in differential temperature measurements as an IC test strategy is also presented

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IEEE Journal of Solid-State Circuits  (Volume:36 ,  Issue: 1 )