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Characterization and modeling of multiple coupled on-chip interconnects on silicon substrate

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3 Author(s)
Ji Zheng ; Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA ; V. K. Tripathi ; A. Weisshaar

A quasi-static EM solver based on partial element equivalent circuits is applied to characterize multiple coupled microstrip on-chip interconnects on silicon. The EM solver takes into account the substrate skin effect as well as the conductor skin and proximity effects. Equivalent circuits consisting of only ideal passive elements are extracted from the EM data. Extraction results are presented for a coupled three-line interconnect structure

Published in:

Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.

Date of Conference:

2000