By Topic

Characterization and modeling of multiple coupled on-chip interconnects on silicon substrate

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Ji Zheng ; Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA ; V. K. Tripathi ; A. Weisshaar

A quasi-static EM solver based on partial element equivalent circuits is applied to characterize multiple coupled microstrip on-chip interconnects on silicon. The EM solver takes into account the substrate skin effect as well as the conductor skin and proximity effects. Equivalent circuits consisting of only ideal passive elements are extracted from the EM data. Extraction results are presented for a coupled three-line interconnect structure

Published in:

Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.

Date of Conference: