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Browse Conference Publications > Electrical Performance of Ele ... Help

CPAM: a common power analysis methodology for high-performance VLSI design

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5 Author(s)
Neely, J.S. ; IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA ; Chen, H.H. ; Walker, S.G. ; Venuto, J.
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A common power analysis methodology has been developed to estimate on-chip thermal power, identify potential electromigration problems, and minimize power supply noise. Comprehensive analysis results from CPAM provide the critical data needed to improve system performance and reliability for high-end processor design

Published in:
Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.

Date of Conference: 2000

Page(s):
303 - 306
Meeting Date :
23 Oct 2000-25 Oct 2000
Print ISBN:
0-7803-6450-3
INSPEC Accession Number:
6874225
Conference Location :
Scottsdale, AZ
Digital Object Identifier :
10.1109/EPEP.2000.895550
Product Type:
Conference Publications

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