By Topic

High frequency modelling of power/ground plane pairs with lossy substrates

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Yong-Kee Yeo ; Dept. Adv. Packaging Dev. Support, Inst. of Microelectron., Singapore ; Iyer, M.K. ; Shih-Yeh Lee ; Mook-Seng Leong

A methodology for modelling power/ground plane pairs with lossy substrates has been developed. It is based on transmission lines and includes high frequency effects like dielectric loss and dispersion. A simulation model is constructed using this methodology and the results are compared with measurements and with another model using distributed lumped elements

Published in:

Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.

Date of Conference: