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High frequency modelling of power/ground plane pairs with lossy substrates

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4 Author(s)
Yong-Kee Yeo ; Dept. Adv. Packaging Dev. Support, Inst. of Microelectron., Singapore ; Iyer, M.K. ; Shih-Yeh Lee ; Mook-Seng Leong

A methodology for modelling power/ground plane pairs with lossy substrates has been developed. It is based on transmission lines and includes high frequency effects like dielectric loss and dispersion. A simulation model is constructed using this methodology and the results are compared with measurements and with another model using distributed lumped elements

Published in:

Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.

Date of Conference:

2000