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Numerical analysis of conductive adhesive based flip chip connections

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2 Author(s)
Starski, J.P. ; Chalmers Univ. of Technol., Goteborg, Sweden ; Rudnicki, J.

In this paper, we present computer simulations for interconnections between a CPW transmission line and a CPW chip (CPW-CPW) using isotropic and anisotropic conductive adhesives. The location and size of the particles in both types of adhesives are investigated for both interconnection types

Published in:

Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.

Date of Conference: