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Modeling of time-pressure fluid dispensing processes

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3 Author(s)
X. B. Chen ; Dept. of Mech. Eng., Saskatchewan Univ., Saskatoon, Sask., Canada ; G. Shoenau ; W. J. Zhang

The process of time-pressure fluid dispensing has been widely employed in the semiconductor industry, where the fluid is applied to boards or substrates. In such a process, the flow rate of fluid dispensed and the shape of fluid formed on the board are the two most critical performance indexes, yet extremely difficult to represent because of their complex behavior. This paper presents the development of a model for the time-pressure fluid dispensing process, by which the flow rate and shape can be established. Experiments have been performed to validate the model developed

Published in:

IEEE Transactions on Electronics Packaging Manufacturing  (Volume:23 ,  Issue: 4 )