Referenced Items are not available for this document.
With the use of a device simulator, we show that an ESD protection circuit whose junction filled with contacts is suited to a scaled STI process having thin n- junction with n+ being implanted from contact holes. We have confirmed by measurements that the protection has sufficient robustness
Published in:
Electronics Packaging Manufacturing, IEEE Transactions on
(Volume:23
,
Issue:
4
)
Date of Publication: Oct 2000
- Page(s):
- 246 - 254
- ISSN :
- 1521-334X
- INSPEC Accession Number:
- 6822654
- Digital Object Identifier :
- 10.1109/6104.895068
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 06 August 2002
- Issue Date :
- Oct 2000
- Sponsored by :
- IEEE Components, Packaging, and Manufacturing Technology Society
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