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Browse Journals & Magazines > Electronics Packaging Manufac ...> Volume:23 Issue:4 Help

Design methodology of a robust ESD protection circuit for STI process 256 Mb NAND flash memory

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3 Author(s)
Ikehashi, T. ; TOSHIBA Corporation ; Imamiya, K. ; Sakui, K.

First Page of the Article

Published in:
Electronics Packaging Manufacturing, IEEE Transactions on  (Volume:23 ,  Issue: 4 )

Date of Publication: Oct 2000

Page(s):
235
ISSN :
1521-334X
Digital Object Identifier :
10.1109/TEPM.2000.895053
Product Type:
Journals & Magazines
Date of Current Version :
06 August 2002
Issue Date :
Oct 2000
Sponsored by :
IEEE Components, Packaging, and Manufacturing Technology Society

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