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Power pin testing: making the test coverage complete

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3 Author(s)
de Jong, F. ; Philips Res., Netherlands ; Kup, B. ; Schuttert, R.

Most modern ICs have multiple power and ground pins. It becomes necessary that all these pins are indeed connected to the board. In this paper a structural test method is presented for testing the connections of power and ground pins to the board. This on-chip test method is based on supply current detection between a bonding pad and its connection to the IC power distribution network. The method has been implemented and evaluated on a CMOS IC, using IEEE Std. 1149.1 to control and observe the embedded current sensors

Published in:

Test Conference, 2000. Proceedings. International

Date of Conference:

2000