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Flip-chip integration of selectively oxidized 850 nm VCSEL arrays

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4 Author(s)
K. M. Geib ; Sandia Nat. Labs., Albuquerque, NM, USA ; K. D. Choquette ; A. A. Allerman ; J. J. Hindi

Summary form only given. We report the fabrication techniques for flip-chip integration of selectively oxidized 850 nm 8x8 individually addressable VCSEL arrays. For robust integration of 2-dimensional 850 nm VCSEL arrays to microelectronics, there are three challenges to overcome: 1) reliable bonding; 2) mechanically stable packaging; and 3) through substrate light emission

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Lasers and Electro-Optics Society 2000 Annual Meeting. LEOS 2000. 13th Annual Meeting. IEEE  (Volume:2 )

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