Referenced Items are not available for this document.
Summary form only given. We report the fabrication techniques for flip-chip integration of selectively oxidized 850 nm 8x8 individually addressable VCSEL arrays. For robust integration of 2-dimensional 850 nm VCSEL arrays to microelectronics, there are three challenges to overcome: 1) reliable bonding; 2) mechanically stable packaging; and 3) through substrate light emission
Published in:
Lasers and Electro-Optics Society 2000 Annual Meeting. LEOS 2000. 13th Annual Meeting. IEEE
(Volume:2
)
Date of Conference: 2000
- Page(s):
- 850 - 851 vol.2
- Meeting Date :
- 13 Nov 2000-16 Nov 2000
- ISSN :
- 1092-8081
- Print ISBN:
- 0-7803-5947-X
- INSPEC Accession Number:
- 7055230
- Conference Location :
- Rio Grande
- Digital Object Identifier :
- 10.1109/LEOS.2000.894121
- Product Type:
- Conference Publications
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