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A method to evaluate delamination in IC packages by millimeter-wave technique was studied. An open-ended coaxial line sensor was used as source and also as receiver of millimeter-wave signal that was transmitted into and reflected from the packages. The phase of the reflection coefficient causes a shift due to the presence of the delamination. The phase shift of the reflection coefficient in the cases of with and without delamination was proposed to be used to evaluate the delamination.