By Topic

Fast and efficient parametric modeling of contact-to-substrate coupling

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Masoumi, N. ; Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada ; Elmasry, M.I. ; Safavi-Naeini, S.

This paper presents two rapid and yet accurate modeling methods for substrate coupling between a device contact and a substrate backplane. We discuss effects of physical parameters and geometrical characteristics of the contact and the substrate on the proposed models. We also derive model expressions for extraction of circuit-model elements of the substrate. Both methods are efficient for speed, memory usage, and adaptable to computer-aided design (CAD) tools for optimization tasks. The accuracy of both methods, the parametric modeling method and the microstrip line approximation method, is validated by comparing with the rigorous simulation data obtained from IE3D. Using the new models, we record a much higher speedup factor and extremely lower memory requirements compared to other published methods. The modeling methods are extended to two-layer structures and the models are applied to spiral inductors for verification purposes. In our research, we have validated the models over a wide range of frequencies up to 20 GHz

Published in:

Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on  (Volume:19 ,  Issue: 11 )