Cart (Loading....) | Create Account
Close category search window

Link performance of time-division duplex DS-CDMA mobile communication system

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Chang Jiang ; Wireless Commun. Center, Beijing Univ. of Posts & Telecommun., China ; Wang Wenbo ; Yang DaCheng

We present the link performance of a wideband time-division duplex DS-CDMA system for the third-generation mobile communication system. Computer simulations by means of Monte Carlo integration are made to evaluate the link performance of the time-division duplex DS-CDMA system under a generalized Rayleigh fading multipath channel. 8 kbit/s speech service is mainly adopted. The differences from frequency-division duplexing (FDD) are also shown, and the advantages of using a TDD system are discussed. Simulation results under various radio channel environments are given and the impact of Doppler shift on the link performance is investigated. Some techniques that can be used to reduce the required Eb/N0 are also employed

Published in:

Communication Technology Proceedings, 2000. WCC - ICCT 2000. International Conference on  (Volume:1 )

Date of Conference:


Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.