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Prediction of paddle shift via 3-D TSOP modeling

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4 Author(s)
F. Su ; Dept. of Package Dev., ChipMOS Technol. Inc., Tainan, Taiwan ; Sheng-Jye Hwang ; Huei-Huang Lee ; Durn-Yuan Huang

This study develops a methodology to simulate the molding process of thin small outline packages (TSOPs) and to predict the paddle shift caused by pressure difference and viscous stress during molding through the help of a true three-dimensional (3-D) Computational Fluid Dynamics (CFD) software

Published in:

IEEE Transactions on Components and Packaging Technologies  (Volume:23 ,  Issue: 4 )