By Topic

Manufacturing and materials properties of Ti/Cu/Electroless Ni/solder bump on Si

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Kwang-Lung Lin ; Dept. of Mater. Sci. & Eng., Nat. Cheng Kung Univ., Tainan, Taiwan ; Kun-Tzu Hsu

This work attempted to fabricate the solder bump with the structure: Si/Ti/Cu/Electroless Ni/solder. The shear strength of the solder bump, with bump pad of 60 μm in diameter, is around 15 g/bump prior to and after reflow. The solder bumps fractured at the solder. Humidity test at 85% of relative humidity at 85°C and a high temperature treatment at 150°C for 1000 h tend to downgrade the shear strength of the solder portion of the bump, yet not the interface. Both treatments enhance the growth of intermetallic compound (IMC) formed between Ni and solder. The barrier effect of electroless nickel deposit was investigated

Published in:

IEEE Transactions on Components and Packaging Technologies  (Volume:23 ,  Issue: 4 )