Cart (Loading....) | Create Account
Close category search window

High power IGBT modules: thermal fatigue resistance evaluation of the solder joints

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Thebaud, J.-M. ; Lab. IXL, Bordeaux I Univ., Talence, France ; Woirgard, E. ; Zardini, C. ; Sommer, K.-H.

Extensive accelerated aging tests have been carried out with representative test structures in order to evaluate the thermal fatigue resistance of five solder alloys intended for high power IGBT modules. With regard to the chip-to-substrate samples, Pb-free preforms have given excellent results since the thermal impedance of these hybrid assemblies has hardly changed during thermal cycling, even after 2000 shocks between +125°C and -55°C (less than 5%). The best results have been clearly obtained with the finest solder microstructures. In addition, the analysis of the results has led to an evaluation of the acceleration factor of the thermal fatigue tests. Finally, SEM observations of cross-sectioned samples have shown crack propagation during thermal cycling which is responsible for the increased thermal impedance. However, with regard to substrate-to-baseplate samples, the best results have been obtained with a Pb-bearing solder alloy strongly subject to coarsening during thermal cycling. Moreover, it has been demonstrated that fast cooling can cut crack growth rate in the solder joints by half. In addition, EDX analyses have shown copper diffusion all over the solder joint when the DBC (direct bonded copper) substrate is not nickel-plated, which seems to slightly improve its fatigue resistance. Finally, these experiments have shown that fine solder microstructures do not necessarily lead to good fatigue performances at high levels of stress or strain

Published in:

Integrated Power Packaging, 2000. IWIPP 2000. International Workshop on

Date of Conference:


Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.