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Kinetics of interface reaction in 40Sn-Bi/Cu and 40Sn-Bi-2Ag/Cu systems during aging in solid state

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3 Author(s)
Zhuo-Ming Guan ; Dept. of Mater. Sci. & Eng., Univ. of Sci. & Technol. of China, Hefei, China ; Guo-Xun Liu ; Tao Liu

The characteristics of thickening kinetics of the intermetallic compounds (IMC) (Cu6Sn5+Cu3Sn) during aging at 120°C and 90°C in solid state were studied by quantitative metallographic analysis for three solder alloy systems: 40Sn-Bi/Cu, 40Sn-Bi-2Ag/Cu and Sn-37Pb/Cu. The diffusion couples were prepared by hot immersion in the molten solder bath. The results showed that the rate of the IMC thickening increases in the order Sn-37Pb/Cu<40Sn-Bi/2-Ag/Cu<40Sn-Bi/Cu. The IMC thickening rate in the Sn-Bi eutectic system is one order of magnitude faster than that in Sn-Pb eutectic system. The time exponents are different from each other. The relationship between the increase of IMC and aging time follows a parabolic function in the Sn-Pb system, and a linear relation in the Sn-Bi system. Addition of Ag in Sn-Bi inhibits the IMC thickening process.

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Advanced Packaging, IEEE Transactions on  (Volume:23 ,  Issue: 4 )