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A novel bidirectional optical coupling module for subscribers

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6 Author(s)
Gwan-Chong Joo ; Microelectron. Technol. Lab., Electron. & Telecommun. Res. Inst., Taejon, South Korea ; Sang-Hwan Lee ; Ki-Sung Park ; Jae-Shik Choi
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To overcome drawbacks and limitations of planar lightwave circuit based modules for bidirectional communications, such as the demand for several chips and in consequence more packaging efforts, we have recently developed a novel optical coupling technique using our unique 155 Mbps bidirectional laser chip. Since the chip is structured with a pin-photodiode monolithically integrated on a laser diode's waveguide, the optical coupling requires only the alignment of the chip with a fiber. To optically couple the laser diode and photodiode simultaneously with a single fiber, we have designed an unusual coupling structure using a fiber having a cleaved surface whose normal is 35° angled to the fiber core axis, and using an index-controlling medium with a refractive index of ∼1.3. The bidirectional chip is flip-chip bonded and the fiber is passively aligned using a V-groove on the same substrate of 2.5×1.3 mm2 in size. Even with this extremely small and simple scheme for bidirectional optical coupling, we could obtain an optical output power of -7∼-10 dBm and a responsivity of <-30 dBm, which are satisfactory to the STM-1 level telecommunications specifications.

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Advanced Packaging, IEEE Transactions on  (Volume:23 ,  Issue: 4 )