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Mechanical characterization of plastic ball grid array package flexure using moire interferometry

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3 Author(s)
Stout, E.A. ; Motorola Inc., Northbrook, IL, USA ; Sottos, Nancy R. ; Skipor, A.F.

Most previous studies of PBGA packaging reliability focused on the effect of thermal cycling. However, as portable electronic products such as cellular phones and laptop computers are reduced in size and become more readily available, isothermal flexural fatigue also becomes an important reliability issue. Solder interconnects subjected to mechanically induced deformation may result in failure. In the current work, moire interferometry is used to investigate the influence of PCB flexure on interconnect strains. A versatile testing apparatus is developed to load PBGA packages in four point bending. Moire fringe patterns are recorded and analyzed at various bending loads to examine the variation in displacement and strain between the components. Solder balls across the entire array experience large shear strains, often resulting in plastic deformation, which reduces service life of the package.

Published in:

Advanced Packaging, IEEE Transactions on  (Volume:23 ,  Issue: 4 )