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Browse Journals & Magazines > Advanced Packaging, IEEE Tran ...> Volume:23 Issue:4 Help

Packaging design of microsystems and meso-scale devices

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1 Author(s)
Tai-Ran Hsu ; Dept. of Mech. & Aerosp. Eng., San Jose State Univ., CA, USA

This paper will present an overview on electromechanical packaging of microelectromechanical systems (MEMS) and microsystems such as microsensors, actuators, and fluidics. Technical problems and major issues related to packaging design will also be presented and discussed.

Published in:
Advanced Packaging, IEEE Transactions on  (Volume:23 ,  Issue: 4 )

Date of Publication: Nov 2000

Page(s):
596 - 601
ISSN :
1521-3323
INSPEC Accession Number:
6780440
Digital Object Identifier :
10.1109/6040.883747
Product Type:
Journals & Magazines
Date of Current Version :
06 August 2002
Issue Date :
Nov 2000
Sponsored by :
IEEE Components, Packaging, and Manufacturing Technology Society

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