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Packaging design of microsystems and meso-scale devices

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1 Author(s)
Tai-Ran Hsu ; Dept. of Mech. & Aerosp. Eng., San Jose State Univ., CA, USA

This paper will present an overview on electromechanical packaging of microelectromechanical systems (MEMS) and microsystems such as microsensors, actuators, and fluidics. Technical problems and major issues related to packaging design will also be presented and discussed.

Published in:

Advanced Packaging, IEEE Transactions on  (Volume:23 ,  Issue: 4 )