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Miniaturised 45° power divider using three-dimensional MMIC technology

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4 Author(s)
Hayashi, H. ; NTT Network Innovation Labs., Kanagawa, Japan ; Piernas, B. ; Nishikawa, K. ; Nakagawa, T.

A miniaturised 45° power divider using three-dimensional MMIC technology is described. The divider comprises stacked thin-film microstrip lines that sandwich a ground plane between them. It has an area of only 0.43 mm2, and it exhibits a coupling of 4.5±0.2 dB and a phase difference of 45±1° from 28 to 33 GHz

Published in:

Electronics Letters  (Volume:36 ,  Issue: 21 )

Date of Publication:

12 Oct 2000

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