By Topic

3D transient analysis of electromechanical devices using parallel BEM coupled to FEM

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Rischmuller, V. ; Inst. fur Theor. der Elektrotech., Stuttgart Univ., Germany ; Haas, M. ; Kurz, S. ; Rucker, W.M.

This paper describes the coupling of the parallel BEM to the FEM within the framework of a preconditioned iterative solver based on domain decomposition. This approach allows to overcome the limitations that arise on a serial computer when a 3D transient analysis of electromechanical devices should be performed. The parallel implementation of different BEM solution tasks is discussed. The numerical modeling of an electromechanical relay is presented as an example, including performance issues

Published in:

Magnetics, IEEE Transactions on  (Volume:36 ,  Issue: 4 )