Referenced Items are not available for this document.
For pt. I see ibid., vol. 47, no. 11, (Nov. 2000). Novel compact expressions that describe the transient response of high-speed resistance, inductance, and capacitance (RLC) coupled interconnects are rigorously derived. These new distributed rlc models reveal that peak crosstalk voltage is over 60% larger for 3 GHz high-speed interconnects than predicted by current distributed RC models. Simplified forms of the compact models enable physical insight and accurate estimation of peak crosstalk voltage between two and three distributed RLC interconnects
Published in:
Electron Devices, IEEE Transactions on
(Volume:47
,
Issue:
11
)
Date of Publication: Nov 2000
- Page(s):
- 2078 - 2087
- ISSN :
- 0018-9383
- INSPEC Accession Number:
- 6751606
- Digital Object Identifier :
- 10.1109/16.877169
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 06 August 2002
- Issue Date :
- Nov 2000
- Sponsored by :
- IEEE Electron Devices Society
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