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Compact distributed RLC interconnect models. I. Single line transient, time delay, and overshoot expressions

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2 Author(s)
J. A. Davis ; Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA ; J. D. Meindl

Novel compact expressions that describe the transient response of a high-speed distributed resistance, inductance, and capacitance (RLC) interconnect are rigorously derived with on-chip global interconnect boundary conditions. Simplified expressions enable physical insight and accurate estimation of transient response, time delay, and overshoot for high-speed global interconnects with the inclusion of inductance

Published in:

IEEE Transactions on Electron Devices  (Volume:47 ,  Issue: 11 )