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FDTD modeling of printed circuit board signal integrity and radiation

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4 Author(s)
Fornberg, P. ; Dept. of Electr. Eng., Colorado Univ., Boulder, CO, USA ; Byers, A. ; Piket-May, M. ; Holloway, C.L.

Increasing bus speeds between components on a printed circuit board (PCB) create many new problems for signal integrity (SI) and EMC engineers. Non-ideal ground paths can cause both signal integrity degradation and increased electromagnetic radiation. Another cause of radiation is the effects of a finite ground plane. This paper presents a study of the SI and EMC issues due to these structures based on finite-difference time-domain (FDTD) simulations

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Electromagnetic Compatibility, 2000. IEEE International Symposium on  (Volume:1 )

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