By Topic

FDTD modeling of printed circuit board signal integrity and radiation

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Fornberg, P. ; Dept. of Electr. Eng., Colorado Univ., Boulder, CO, USA ; Byers, A. ; Piket-May, M. ; Holloway, C.L.

Increasing bus speeds between components on a printed circuit board (PCB) create many new problems for signal integrity (SI) and EMC engineers. Non-ideal ground paths can cause both signal integrity degradation and increased electromagnetic radiation. Another cause of radiation is the effects of a finite ground plane. This paper presents a study of the SI and EMC issues due to these structures based on finite-difference time-domain (FDTD) simulations

Published in:

Electromagnetic Compatibility, 2000. IEEE International Symposium on  (Volume:1 )

Date of Conference:

2000