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In this paper, two types of the microstrip duplexers for third generation mobile communication systems are investigated, In our design, good performance, compact size and low cost are considerations. Simulation and optimization are carried out with the aid of numerical methods for high frequency EM problems, and accurate results are obtained. The loss caused by both the substrate and metallization is taken into account. The duplexers are made and tested. The experimental results agree well with those of simulation.