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A temperature-aware simulation environment for reliable ULSI chip design

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2 Author(s)
Yi-Kan Cheng ; Somerset Design Center, Motorola Inc., Austin, TX, USA ; Sung-Mo Kang

In this paper, we present a temperature-aware simulation environment, iTAS, which has been developed for the design of thermally reliable ultra-large scale integrated (ULSI) chips. This environment provides advisory information from the early chip design phase to the post-layout analysis phase. Several important applications, including temperature-sensitive timing analysis, efficient on-chip hot-spot identification, and thermally reliable package design are addressed, iTAS can be used not only for reliability checking, but also for better thermal engineering to enhance the overall chip performance

Published in:

Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on  (Volume:19 ,  Issue: 10 )

Date of Publication:

Oct 2000

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