Scheduled System Maintenance:
Some services will be unavailable Sunday, March 29th through Monday, March 30th. We apologize for the inconvenience.
By Topic

Modeling flexural plate wave devices

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Weinberg, M.S. ; Charles Stark Draper Lab. Inc., Cambridge, MA, USA ; Cunningham, B.T. ; Clapp, C.W.

A lumped-parameter model is derived for flexural plate wave (FPW) devices which are rectangular plates or diaphragms with structural layers, a piezoelectric layer, and with interdigitated conducting combs for driving and sensing. This configuration is often used in micromechanical chemical sensors. The model is based an a closed-form solution of a resonating beam; however, the results are applicable to plates supported on four edges. The model gives a voltage or charge output from the sense combs as a function of voltage applied to the drive combs. The analysis predicts the response of the multiple plate modes to axial tensions and to comb finger dimensions and position relative to the diaphragm eigenfunctions. These models are much more detailed than those described in the literature on acoustic chemical sensors and are difficult to obtain by finite-element solutions. Frequency responses of FPW devices constructed from silicon with deposited aluminum nitride as the piezoelectric compared well with analytic results. The effects of boundary conditions on the plate's lateral edges are discussed in both the analysis and testing.

Published in:

Microelectromechanical Systems, Journal of  (Volume:9 ,  Issue: 3 )