Simple technique for fine tuning of impedance matching circuits for the mm-wave region

This paper describes a simple technique to achieve fine tuning in bandpass impedance matching circuits. The technique takes advantage of the parasitic inductance of the required bondwire interconnection between the active device and the microstrip circuit using the shape of the bondwire as the means of tuning. An experimental tuning range of 160 MHz at 20 GHz was obtained for a single bondwire of 0.5 mm in length. The technique can easily be extended to other applications, which require bondwire interconnects.