Cart (Loading....) | Create Account
Close category search window

Simple technique for fine tuning of impedance matching circuits for the mm-wave region

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Gomez-Rojas, L. ; Electron. Eng. Labs., Kent Univ., Canterbury, UK ; Gomes, N.J. ; Wang, X. ; Davies, P.A.

This paper describes a simple technique to achieve fine tuning in bandpass impedance matching circuits. The technique takes advantage of the parasitic inductance of the required bondwire interconnection between the active device and the microstrip circuit using the shape of the bondwire as the means of tuning. An experimental tuning range of 160 MHz at 20 GHz was obtained for a single bondwire of 0.5 mm in length. The technique can easily be extended to other applications, which require bondwire interconnects

Published in:

Packaging and Interconnects at Microwave and mm-Wave Frequencies (Ref. No. 2000/083) IEE Seminar

Date of Conference:


Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.