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Development of super fine pattern PWB MOSAIC

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5 Author(s)

A variety of build up and/or multi layer PWBs is proposed. In each case, the key points are fine patterning, small via hole connection and surface mount compatibility. Previously, we developed a 2 layer flexible circuit, without an adhesive layer, called Hyper FlexTM, which is capable of lower thickness and narrower lines compared with conventional flexible circuits with adhesion. Using this high density print wiring board, we have developed a unique and simple build up PWB, MOSAIC (Multiple Organic Accumulated Inter Connection) series. MOSAIC contains 2 series, MOSAIC-F and MOSAIC-R. MOSAIC-F consists of all flexible layers with ultra fine patterns for CSP/MCM semiconductor attachment. MOSAIC-R consists of a core layer and flex layers (Hyper FlexTM) for fine pattern multi layer mother boards. This paper introduces MOSIAC-R, which achieves ultra fine pattern multi layer PWBs at large area with reasonable cost for digital mobile products

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Advanced Packaging Materials: Processes, Properties andInterfaces, 2000. Proceedings. International Symposium on

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