Halogen-free materials for PWB and advanced package substrate

We have developed halogen-free technologies, consisting of resin systems with high filler content. The point of the technology is the development of a new resin system (RO resin) which incorporates nitrogen into the molecule frame in large quantities. The high filler content technology develops a new filler interphase control system (FICS) which enables the high dispersion of fillers. A variety of halogen-free substrates which can be applied to diversified needs have been developed by combining these technologies. They are MCL-RO-67G, a thin laminate for the multi-layer PWBs, MCF-4000G, a build-up material for high density interconnect (HDI), and MCL-E-679F(G), a high Tg laminate for advanced plastic IC packages (PKGs) and PWBs. These materials have excellent heat-resistance, and are suitable for lead-free solder. The robustness towards temperature, humidity and frequency of those materials is better than that of current materials. The synthetic board design of environmental harmony type becomes easy by combined use of these materials.