By Topic

Formation, distribution and failure effects of voids in vapor-phase soldered small solder volumes

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Villain, J. ; Univ. of Appl. Sci., Augsburg, Germany ; Beschorner, M. ; Hacke, H.J. ; Brabetz, B.
more authors

The formation of voids in small solder volumes, e.g. flip-chip-soldered electronic components, is of vital interest to determine their reliability. The aim of the study was to understand the physical and chemical reasons for void formation in small solder volumes, the determination of void diameters depending on soldering temperature and flux content. A further investigation was made to define the strength of the solder balls depending on void diameter and void distribution. The diameter and the location of the voids was measured by X-ray-detection. The results show an increase of voids with increasing soldering time at constant temperature and a rapid decrease of void diameter at a soldering time nearby 60 sec followed by a slower increase of voids. The distribution of void diameter shows a great amount of small voids and only some big voids. The distribution of the void diameter is a skew distribution. The shear strength of the soldered joints shows only a little influence on the voids amount. These results give hints for the optimized time-temperature-curves for the best soldering profile. Further investigations are necessary to determine the influence of the voids to thermomechanical stresses and vibration behavior

Published in:

Advanced Packaging Materials: Processes, Properties andInterfaces, 2000. Proceedings. International Symposium on

Date of Conference: