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Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507)

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The following topics were dealt with: adhesives; integrated passives; underfills; encapsulation; flip chip bumping; solder; chip scale packages; high density substrates; thermomechanical effects

Published in:

Advanced Packaging Materials: Processes, Properties andInterfaces, 2000. Proceedings. International Symposium on

Date of Conference:

6-8 Aug. 2000