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Enhanced skin effect for partial-element equivalent-circuit (PEEC) models

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3 Author(s)
Coperich, K.M. ; Illinois Univ., Urbana, IL, USA ; Ruehli, A.E. ; Cangellaris, A.

In this paper, a skin-effect modeling approach is presented that is suitable for all frequency regimes of interest and therefore is most appropriate for transient interconnect analysis. Yet, the new formulation lends itself to a model that can be abstracted for use in conjunction with surface integral and finite difference-based electromagnetic tools for interconnect modeling. While a volume filament technique is not computationally feasible at high frequencies, where a fine discretization is necessary, the formulation that is presented avoids this difficulty by carefully casting the behavior of a conductor into the form of a global surface impedance, thus requiring fewer unknowns. Several examples illustrating the ability of the proposed model to accurately capture proximity and skin-effect behaviors will be shown, Interconnect resistance and inductance per-unit-length results are given and compared with those obtained using different models

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Microwave Theory and Techniques, IEEE Transactions on  (Volume:48 ,  Issue: 9 )