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High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm

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7 Author(s)
Woonghwan Ryu ; Korea Adv. Inst. of Sci. & Technol., Taejon, South Korea ; Myung-Jin Yim ; Seungyoung Ahn ; Junho Lee
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This paper firstly reports on the high-frequency SPICE model of the ACF flip-chip interconnections up to 13 GHz. The extraction process is based on an optimization procedure, called a genetic algorithm, which is known as a robust optimization tool. The proposed equivalent circuit model of the ACF interconnection can readily be used in SPICE circuit simulations for signal integrity analysis of high-frequency packages. Two different ACF interconnections were studied using the Au-coated polymer ball and Ni-filled ball. The extracted models of the two ACFs were found strongly dependent on not only size and rigidity of the conducting balls, but also on their magnetic permeability

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IEEE Transactions on Components and Packaging Technologies  (Volume:23 ,  Issue: 3 )