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High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm

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7 Author(s)
Woonghwan Ryu ; Korea Adv. Inst. of Sci. & Technol., Taejon, South Korea ; Myung-Jin Yim ; Seungyoung Ahn ; Junho Lee
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This paper firstly reports on the high-frequency SPICE model of the ACF flip-chip interconnections up to 13 GHz. The extraction process is based on an optimization procedure, called a genetic algorithm, which is known as a robust optimization tool. The proposed equivalent circuit model of the ACF interconnection can readily be used in SPICE circuit simulations for signal integrity analysis of high-frequency packages. Two different ACF interconnections were studied using the Au-coated polymer ball and Ni-filled ball. The extracted models of the two ACFs were found strongly dependent on not only size and rigidity of the conducting balls, but also on their magnetic permeability

Published in:

Components and Packaging Technologies, IEEE Transactions on  (Volume:23 ,  Issue: 3 )

Date of Publication:

Sep 2000

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