By Topic

Mechanism of contact enhancing chemicals for electrical interconnection

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Gao, G. ; Res. Lab., Ford Motor Co., Dearborn, MI, USA ; Dongkai Shangguan

Contact enhancing chemicals, the magic fluids which vanquish intermittent contacts, have been in existence for many years. However, their use has been very limited due to the lack of understanding of their conduction mechanism. In this paper, electrochemical experiments were conducted to reveal the mechanism of conduction through the contact enhancing chemicals. The results have invalidated claims by several manufacturers of contact enhancing chemicals that conduction takes place by means of “tunneling.” It has been demonstrated that these novel chemicals function through a rather common conduction mechanism, by serving as an electrolyte for metal dissolution, ionic transport, and metal deposition. Metallurgical examinations have provided direct evidence of the existence of metallic dendrites between mating elements that have been treated with the chemicals, and confirmed the electrochemical reaction mechanism for contact enhancement

Published in:

Components and Packaging Technologies, IEEE Transactions on  (Volume:23 ,  Issue: 3 )