Cart (Loading....) | Create Account
Close category search window

Reliability and failure analyses of thermally cycled ball grid array assemblies

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Ghaffarian, R. ; Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA ; Kim, N.P.

The reliability of ball grid arrays (BGAs) was assessed as part of a consortium effort led by the Jet Propulsion Laboratory. Nearly 200 test vehicles, each with four packages, were assembled and tested using an experiment design. The most critical variables incorporated in for the experiment were package types, ceramic and plastic; board materials, FR-4 and polyimide; surface finishes, OSP, HASL, and Ni/Au; solder volumes, low, standard, and high; and environmental conditions. Thermal cycling test results to 3000 cycles for ceramic packages with 625 inputs/outputs (I/Os) and depopulated full array plastic packages with 313 I/Os were presented in a previous paper by the authors (see Proc 30th Int. Symp. Microelectron., Philadelphia, PA, Oct. 1997, p. 396-400). This paper presents the most current thermal cycling test results (>6000 cycles) for plastic OMPAC and SuperBGA packages with 352 I/Os and 560 I/Os. Failure mechanisms detected by electrical continuity interruptions as well as optical and scanning electron microscopy results are also compared for ceramic and plastic package assemblies

Published in:

Components and Packaging Technologies, IEEE Transactions on  (Volume:23 ,  Issue: 3 )

Date of Publication:

Sep 2000

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.