By Topic

Nonuniform temperature and strain fields in a powered package

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
J. Wakil ; Mech./Thermal Anal. & Test Group, IBM Corp., Endicott, NY, USA ; P. S. Ho

This paper analyzes the nonuniform temperature and strain fields resulting from power dissipation in an electronic package. A 208 lead plastic quad flat pack (PQFP) manufactured by Texas Instruments is used to show the temperature distribution and mechanical deformation resulting from power dissipation in the package. The package is tested experimentally and thermally modeled using finite element analysis to obtain the temperature distribution in the active package. The moire interferometry technique is used to acquire displacement contours of an active PQFP and the results are compared to a uniformly heated sample. The results revealed that the thermal loading due to internal power dissipation produces significantly different strains than a uniformly heated sample

Published in:

IEEE Transactions on Components and Packaging Technologies  (Volume:23 ,  Issue: 3 )