By Topic

Plastic microoptical interconnection modules for parallel free-space interand intra-MCM data communication

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

10 Author(s)
H. Thienpont ; Lab. for Photonics, Vrije Univ., Brussels, Belgium ; C. Debaes ; V. Baukens ; H. Ottevaere
more authors

We design and fabricate a prototype scalable multichannel free-space interconnection module with the potential for Tb/s/spl middot/cm/sup 2/ aggregate bit-rate capacity over inter- and intra-MCM interconnection distances. The component is fabricated in a high quality optical plastic, PMMA, using deep proton lithography, an ion-based rapid prototyping technology. As a feasibility demonstration, data communication is achieved at 622 Mb/s per channel with a bit error rate smaller than 10/sup -13/ for 16 channels with an interchannel crosstalk lower than -22 dB. We perform a sensitivity analysis for misalignments and fabrication errors and study the fabrication issues of these components with injection molding techniques. Finally, we provide evidence that these modules can be mass fabricated with the required precision.

Published in:

Proceedings of the IEEE  (Volume:88 ,  Issue: 6 )