By Topic

Interfacial shear stress, peeling stress, and die cracking stress in trilayer electronic assemblies

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Wang, K. ; Gen. Motors Tech. Center, Warren, MI, USA ; Huang, Y. ; Chandra, A. ; Hu, K.X.

Interfacial shear stress, peeling stress, and die cracking stress due to thermal and elastic mismatch in layered electronic assemblies are one of the major causes of the mechanical failure of electronic packages. A simple but rather accurate method is developed to estimate these thermal stresses for packages with different layer lengths. For layered electronics with thin adhesives, analytical expressions are obtained for interfacial shear stress and peeling stress, and they agree well with the finite element analysis, especially when the moduli of adhesive layers are significantly lower than the moduli of the other layers. An analytic expression of die cracking stress is also obtained for multilayer electronic assemblies

Published in:

Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on  (Volume:2 )

Date of Conference:

2000