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Development of the base technology for surface multichipping modules on the multilayer polyimide boards having the increased mounting density of the add-on components and using modification 2 chip ic in order to organize production of the microelectronic hubrid functional assemblies

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4 Author(s)

First Page of the Article

Published in:

Satellite Communications, 1996. Proceedings of ICSC '96. The 2nd International Conference on  (Volume:4 )

Date of Conference:

1996