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Batch transfer integration of RF microrelays

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3 Author(s)
Milanovic, V. ; Sensor & Actuator Center, California Univ., Berkeley, CA, USA ; Maharbiz, M. ; Pister, K.S.J.

This letter presents the first implementation of batch-transferred microrelays for a broad range of RF applications and substrates. The transferred relays include two types of electrostatic pull-down structures for series and shunt switching of a CPW. The batch-transfer methodology allows integration of optimized microelectromechanical systems (MEMS) in RF systems on substrates such as sapphire, GaAs, and even CMOS. Gold-to-gold contact series microrelays with insertion loss of <0.3 dB, and isolation better than 15 dB at frequencies from 100 MHz to 50 GHz are demonstrated, as well as shunt switches with >45 dB of isolation and <0.3 dB insertion loss in that frequency range

Published in:

Microwave and Guided Wave Letters, IEEE  (Volume:10 ,  Issue: 8 )