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Vertically interconnected 3D module for conformal phased array antennas

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5 Author(s)
Liu, B. ; Dept. of Electr. & Comput. Eng. & Comput. Sci., Cincinnati Univ., OH, USA ; Wang, Y.A. ; Kang, G. ; Ferendeci, A.M.
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The development of a basic X-band 3D-IC/MEMS microwave transmit module is investigated for the possibility of conformal phased array technology. An innovative approach using microelectronics and MEMS processing technologies is implemented to develop 3D-IC processing technology. This allows us to investigate the technology development needed for minimum module depth to enable distribution on any arbitrary surface. For the initial phase, as a demonstration vehicle, a basic passive transmit module is designed, fabricated and characterized at microwave frequencies

Published in:
Phased Array Systems and Technology, 2000. Proceedings. 2000 IEEE International Conference on

Date of Conference: 2000

Page(s):
49 - 52
Meeting Date :
21 May 2000-25 May 2000
Print ISBN:
0-7803-6345-0
INSPEC Accession Number:
6697197
Conference Location :
Dana Point, CA
Digital Object Identifier :
10.1109/PAST.2000.858907
Product Type:
Conference Publications

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